Open Model for External Mechanical Stress of Semiconductors and MEMS for Cascade Microtech REL 3600 probe station by buhler

Last crawled date: 3 years ago

This project defines the details of the bending equipment solution and the calibration required for characterization of external mechanical stress in semiconductors and MEMS. The equipment is suited for use in probe station for electrical characterization of devices under controlled external mechanical stress.
References are listed at the bottom.
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The project was developed using the SketchUp 3D modeling software, from Trimble Inc. The bending equipment and the probe support were designed for use in the Cascade Microtech REL 3600 probe station as it was the one available in our laboratory. However, the design files can be easily adapted to other probe stations.
All original design files are made available in the SketchUp “.skp” and the universal “.stl” file format under the CC BY-NC-SA 3.0 license.
It was chosen to ensure that it can continue to be openly developed and distributed to the scientific community. The papers listed in references intends to give the direction in defining the details of the bending equipment and the calibration used for characterization of mechanical stress in semiconductor materials and MEMS.
Having non-encapsulated IC samples in mind, the present bending setup can dose the amount of uniaxial stress induced in the sample. The mechanical bending parts and materials required are described in table 1.
The upper part of the sample will receive a tensile strain and the lower part will receive a compression strain. To change from tensile to compressive, it is necessary the change all the four cylinders’ positions. To the biaxial strain the equipment should apply the tension or compression with two concentric rings.
Table 2 describes the required parts and materials for the elevated probes support.
The bending equipment and the elevated probe supports are projected to fit in the Cascade Microtech REL 3600 probe station, without losing the use of the microscope.
All the main parts were designed and 3D printed with PLA (Polylactic Acid) filament of 1.75mm, reinforced with steel cylinder liner rails to ensure the stability of the equipment.
Two attached step motors are controlled by an Arduino Nano board to control the movement of the bending equipment remotely from outside of the probe station.
All code files for the Arduino and the Android app project will be available soon in a GitHub project. Stay tunned!
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Table 1 - Parts and materials required for the mechanical bending setup:
Quantity - Description
4 pcs -LM8UU steel linear bearing bushing
4 pcs - 90x12mm steel cylinder liner rail (vertical guides)
4 pcs - 10x6mm steel cylinder liner rail
2 pcs - 10mm long 3/8” threaded rod stainless steel
6 pcs - 3/8” stainless steel finished hex nut
2 pcs - 3/8” stainless steel nylon insert lock finished hex nuts
20 pcs - M3x6mm stainless steel zinc-plated phillips pan-head machine screw
4 pcs - M3x20mm stainless steel zinc-plated phillips pan-head machine screw
4 pcs - M3 stainless steel nylon insert lock finished hex nuts
4 pcs - Inside 3/8” outside 1” stainless steel flat washer
372g - PLA (Polylactic Acid) filament of 1.75mm
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Table 2 - Parts and materials required for the elevated probes support:
Quantity - Description
12 pcs - M4 stainless steel finished hex nut
8 pcs - M4x20mm stainless steel zinc-plated phillips pan-head machine screw
4 pcs - M4x10mm stainless steel zinc-plated phillips pan-head machine screw
132g - PLA (Polylactic Acid) filament of 1.75mm
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Table 3 - Parts required for the automation hardware:
Quantity - Description
1 pc - Arduino Nano Developing Board
2 pcs - Step motor SM1.8-A1740CHNBK-CS
1 pc - Bluetooth Module HM-10
2 pcs - Driver DRV8825
2 pcs - Digital Caliper
1 pc - 100 µF 50V Capacitor (C4)
1 pc - 0.33 µF 50V Capacitor (C1)
1 pc - 0.1 µF 50V Capacitor (C3)
1 pc - 0.1 Ω Resistor (R10)
8 pcs - 10 KΩ Resistor (R2 – R9)
1 pc - 1.5 KΩ Resistor (R11)
1 pc - 3.3 KΩ Resistor (R1)
2 pcs - 1 KΩ Resistor (R16; R18)
2 pcs - 2.2 KΩ Resistor (R17; R19)
1 pc - 12V Switched-Mode Power Supply
4 pcs - NPN Transistor 2N3904 (T1 – T4)
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References:
Open Model for External Mechanical Stress of Semiconductors and MEMShttps://doi.org/10.1109/ICMTS.2018.8383795