Thingiverse
Wemos / Lolin D1 Mini + Adafruit SHTC3 sensor case v2 by cjdavies
by Thingiverse
Last crawled date: 4 years, 11 months ago
After some further testing the previous design evidently didn't have enough separation between the sensor & the MCU, with the temperature readings reliably too high. This new design increases the separation substantially, as well as blocking airflow between the two chambers. The temperature readings are now the same in the case as with the boards bare.
The channel for the wires is designed for 28AWG silicone wire with an outer diameter of ~1.2mm. The corresponding tongue in the lid fills the empty height in the channel to prevent airflow & also holds the lid in place more firmly. Doing it this way rather than raising the floor of the channel allows the wires to be soldered neatly to the underside of the PCBs more easily, without them having to twist 'up' into the channel.
Once again, you will need to play with tolerances to get a nice fit between the base & the lid. I print the lid at 100.5% scale.
Incidentally, I recommend connecting the SHTC3 to the 3.3V output of the ESP8266 board, not the 5V output. This way the heat output of the voltage regulator on the SHTC3 board itself will be reduced as much as possible (efficiency will increase as VIN approaches VOUT).
The channel for the wires is designed for 28AWG silicone wire with an outer diameter of ~1.2mm. The corresponding tongue in the lid fills the empty height in the channel to prevent airflow & also holds the lid in place more firmly. Doing it this way rather than raising the floor of the channel allows the wires to be soldered neatly to the underside of the PCBs more easily, without them having to twist 'up' into the channel.
Once again, you will need to play with tolerances to get a nice fit between the base & the lid. I print the lid at 100.5% scale.
Incidentally, I recommend connecting the SHTC3 to the 3.3V output of the ESP8266 board, not the 5V output. This way the heat output of the voltage regulator on the SHTC3 board itself will be reduced as much as possible (efficiency will increase as VIN approaches VOUT).