Heat transfer analysis on PCB Circuits.

Last crawled date: 3 years, 2 months ago

The complexity of modern printed circuit boards (PCBs) presents design reliability challenges – from electrical, thermal, and mechanical perspectives. Increasing power dissipation and decreasing board size escalate the potential for electronic system failure due to thermal and mechanical overloading of PCBs. Modeling the coupled electrical, thermal, and thermal-induced stresses that exist in a modern PCB design is key to ensuring product reliability. This webinar will review state-of-the-art simulation techniques to analyze power and signal integrity, predict thermal performance, and overcome thermal stress, opening the door to reliable PCB designs at minimal cost and time to market.