Pressure Sensor SPC01B1A

Last crawled date: 1 year, 10 months ago

Enclosure:
The assemble printed circuits fits in a small two pieces enclosure with snap latches. Overall dimensions are with the connector: length 25,6mm x wide 8,0mm x height 17,0mm.

Circuit Design:
Pressure sensor is a piezo resistive element. Very small size and low power consumption and temperature influence. Pressure range is from 0..37kPa . Also available with a range of -50 to 50kPa.
Sensor is connected to a integrated analog sensor signal conditioner. This device provides amplification, calibration, and temperature compensation to enable an overall performance approaching the inherent repeatability of the sensor. The signal path is fully analog while it is digitally controlled. The trimming of the offset and span are calibrated digitally with integrated 16-bit DACs. Advantage are no external components required for trimming. Therefore a low count components and simple printed circuit design.
Signal conditioner IC’s also provides overvoltage Protection to 45V and Reverse-Voltage Protection to 45V. Sensor fault detection. The signal conditioner provides a high-performance ratiometric output that is proportional to the power-supply voltage. Circuit also includes 3 test pins for during production testing, trimming and calibration in a test jig. The analog output pin functions also as a digital in- and output serial interface. Used for a one wire asynchronous serial data communications between the device and a host calibration test system. Hole device power supply is 5V, +/-4mA.

Electronic assembly:
All components are from surface mount type, so that they can be placed automatically by a pick and place machine. For this purpose the printed circuit board is also panelized in a configuration of 5x10 devices, a total of 50 device per panel. Therefore better and easier to handle during production en testing. This is also the reason for the holes in the sides of the panel. These are for alignment purposes during differed stages in the production. Panel is provide with strategy placed milling and V-curves. To facilitate easier separation each sensor devices from the panel. Before separations the panel format can be used in a test jig for testing, trimming and calibration. Holes in the side of the panel can be used for alignment in de test jig. So that the test point on the bottom of the printed circuit board line up with de test pins on the jig. By these pins the totally analog output devices can be digitally trimmed, calibrated and tested.